Resin-Bond Diamond Segments HTG-C3010F

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工业级产品

Resin-Bond Diamond Segments HTG-C3010F

Description

The HTG-C3010F is a resin-bond diamond segment designed for fine polishing of concrete, marble, granite, and terrazzo floors. Available in grits from 50# to 1500#, it delivers smooth surface finishes and consistent polishing results. The 80mm x 10mm pad size fits standard floor grinders, making it an ideal choice for professional flooring contractors working on fine surface finishing.

商品介绍

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Resin-Bond Diamond Segments HTG-C3010F

选型信息（可选规格）

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Model

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商品介绍

Resin-Bond Diamond Segments HTG-C3010F

The HTG-C3010F is a resin-bond diamond segment designed for fine polishing of concrete, marble, granite, and terrazzo floors. Available in grits from 50# to 1500#, it delivers smooth surface finishes and consistent polishing results. The 80mm x 10mm pad size fits standard floor grinders, making it an ideal choice for professional flooring contractors working on fine surface finishing.

产品 ID: HTG-C3010F
当前选中: HTG-C3010F
分类: Resin-Bond Diamond Segments
Model: HTG-C3010F

技术参数

当前选定规格

Model: HTG-C3010F
Grit: 50# 100# 200#400# 800# 1500
Pad Size: 80 mm x 10 mm/3.15 x 0.394 in

注：产品持续升级中，技术参数如有更新，请以实际销售方案为准。

需要帮助选择合适的设备？

提交选型需求，我们会根据您的施工场景提供配置建议和报价方案。