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Resin-Bond Diamond Segments HTG-4CWL
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Resin-Bond Diamond Segments HTG-4CWL
选型信息（可选规格）
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商品介绍
Resin-Bond Diamond Segments HTG-4CWL
Elevate your concrete polishing with the HTG-4CWL Resin-Bond Diamond Segments. Engineered for water grinding, these 4-inch (102mm) tools ensure exceptional scratch removal and a mirror-like finish. Available from 50# to 1000#, they are the ideal choice for contractors requiring consistent, high-gloss results on any project—from heavy coating removal to final polishing.
- 产品 ID
- HTG-4CWL
- 当前选中
- HTG-4CWL
- 分类
- Resin-Bond Diamond Segments
- Model
- HTG-4CWL
技术参数
当前选定规格
- Model
- HTG-4CWL
- Grit
- 50#, 150#, 300#, 500#, 1000#
- Application
- Water Grinding
- Diameter
- 4 in / 102 mm
- Thickness
- 0.3 in / 8 mm
注：产品持续升级中，技术参数如有更新，请以实际销售方案为准。
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