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Resin-Bond Diamond Segments HTG-4CWD
1 / 4
Resin-Bond Diamond Segments HTG-4CWD
选型信息(可选规格)
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商品介绍
Resin-Bond Diamond Segments HTG-4CWD
The HTG-4CWD Resin Dry Polishing Pad is a premium 4-inch diamond tool engineered for aggressive cutting and high grinding efficiency. Featuring a heavy-duty hook-and-loop backing and a flexible base design, it ensures excellent floor adherence and reduces scratches. Compatible with XINGYI LE, HTG, and GX series grinders, this versatile pad is ideal for professional concrete floor polishing, as well as grinding and polishing marble, granite, and terrazzo surfaces in both wet and dry applications.
- 产品 ID
- HTG-4CWD
- 当前选中
- HTG-4CWD
- 分类
- Resin-Bond Diamond Segments
- Model
- HTG-4CWD
技术参数
当前选定规格
- Model
- HTG-4CWD
- Grit
- 50#, 150#, 300#, 500#, 1000#
- Application
- For both dry and wet use
- Diameter
- 4 in / 102 mm
- Thickness
- 0.24 in / 6 mm
注:产品持续升级中,技术参数如有更新,请以实际销售方案为准。
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