工业级产品

Resin-Bond Diamond Segments HTG-4CWD

Description

The HTG-4CWD Resin Dry Polishing Pad is a premium 4-inch diamond tool engineered for aggressive cutting and high grinding efficiency. Featuring a heavy-duty hook-and-loop backing and a flexible base design, it ensures excellent floor adherence and reduces scratches. Compatible with XINGYI LE, HTG, and GX series grinders, this versatile pad is ideal for professional concrete floor polishing, as well as grinding and polishing marble, granite, and terrazzo surfaces in both wet and dry applications.

商品介绍

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Resin-Bond Diamond Segments HTG-4CWD

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商品介绍

Resin-Bond Diamond Segments HTG-4CWD

The HTG-4CWD Resin Dry Polishing Pad is a premium 4-inch diamond tool engineered for aggressive cutting and high grinding efficiency. Featuring a heavy-duty hook-and-loop backing and a flexible base design, it ensures excellent floor adherence and reduces scratches. Compatible with XINGYI LE, HTG, and GX series grinders, this versatile pad is ideal for professional concrete floor polishing, as well as grinding and polishing marble, granite, and terrazzo surfaces in both wet and dry applications.

产品 ID
HTG-4CWD
当前选中
HTG-4CWD
分类
Resin-Bond Diamond Segments
Model
HTG-4CWD

技术参数

当前选定规格

Model
HTG-4CWD
Grit
50#, 150#, 300#, 500#, 1000#
Application
For both dry and wet use
Diameter
4 in / 102 mm
Thickness
0.24 in / 6 mm

注:产品持续升级中,技术参数如有更新,请以实际销售方案为准。

需要帮助选择合适的设备?

提交选型需求,我们会根据您的施工场景提供配置建议和报价方案。