1 / 4
Resin-Bond Diamond Segments HTG-3CDL
需要帮助选择合适的设备？
1 / 4
Resin-Bond Diamond Segments HTG-3CDL
选型信息（可选规格）
仅保留真正影响询价与配置结果的可选项。
* 为必选项
商品介绍
Resin-Bond Diamond Segments HTG-3CDL
The HTG-3CDL Resin Dry Polishing Pad is a premium 3-inch diamond tool designed for concrete dry polishing. Featuring a heavy-duty hook-and-loop backing, it fits most standard floor grinders and stays secure at high speeds. It delivers uniform cutting and a fast, high-gloss finish on concrete, marble, granite, and terrazzo. Available in 50# to 400# grits for professional surface preparation.
- 产品 ID
- HTG-3CDL
- 当前选中
- HTG-3CDL
- 分类
- Resin-Bond Diamond Segments
- Model
- HTG-3CDL
技术参数
当前选定规格
- Model
- HTG-3CDL
- Grit
- 50#, 100#, 200#, 400#
- Application
- Concrete Dry Polishing
- Diameter
- 3 in / 76 mm
- Thickness
- 0.47 in / 12 mm
注：产品持续升级中，技术参数如有更新，请以实际销售方案为准。
需要帮助选择合适的设备？
提交选型需求，我们会根据您的施工场景提供配置建议和报价方案。