1 / 3
Resin-Bond Diamond Segments HTG-4CW2
需要帮助选择合适的设备？
1 / 3
Resin-Bond Diamond Segments HTG-4CW2
选型信息（可选规格）
仅保留真正影响询价与配置结果的可选项。
* 为必选项
商品介绍
Resin-Bond Diamond Segments HTG-4CW2
FLM HTG-4CW2 diamond polishing pad features a premium abrasive formulation engineered for aggressive cutting and high grinding efficiency. It delivers a fast, mirror-like gloss on stone surfaces while minimizing equipment strain. The advanced heat-resistant resin prevents thermal burn marks, ensuring smooth, scratch-free grinding with exceptional wear resistance. *Floormart, floor more.*
- 产品 ID
- HTG-4CW2
- 当前选中
- HTG-4CW2
- 分类
- Resin-Bond Diamond Segments
- MODEL
- HTG-4CW2
技术参数
当前选定规格
- MODEL
- HTG-4CW2
- Grit
- 50#100#200#400#800# 1500 # 2000# 3000#
- Pad Size
- 10 cm x6 mm
注：产品持续升级中，技术参数如有更新，请以实际销售方案为准。
需要帮助选择合适的设备？
提交选型需求，我们会根据您的施工场景提供配置建议和报价方案。