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Resin-Bond Diamond Segments HTG-C3010F
Need help selecting the right setup?
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Resin-Bond Diamond Segments HTG-C3010F
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Product Overview
Resin-Bond Diamond Segments HTG-C3010F
The HTG-C3010F is a resin-bond diamond segment designed for fine polishing of concrete, marble, granite, and terrazzo floors. Available in grits from 50# to 1500#, it delivers smooth surface finishes and consistent polishing results. The 80mm x 10mm pad size fits standard floor grinders, making it an ideal choice for professional flooring contractors working on fine surface finishing.
- Product ID
- HTG-C3010F
- Selected
- HTG-C3010F
- Category
- Resin-Bond Diamond Segments
- Model
- HTG-C3010F
Technical Parameters
Current selected specification
- Model
- HTG-C3010F
- Grit
- 50# 100# 200#400# 800# 1500
- Pad Size
- 80 mm x 10 mm/3.15 x 0.394 in
Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.
Need help selecting the right setup?
Send us your project requirements and we will recommend a fitting configuration and quote plan.