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Resin-Bond Diamond Segments HTG-4CWL
Need help selecting the right setup?
1 / 4
Resin-Bond Diamond Segments HTG-4CWL
Configuration Options
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* Required options
Product Overview
Resin-Bond Diamond Segments HTG-4CWL
Resin-Bond Diamond Segments HTG-4CWL
- Product ID
- HTG-4CWL
- Selected
- HTG-4CWL
- Category
- Resin-Bond Diamond Segments
- Model
- HTG-4CWL
Technical Parameters
Current selected specification
- Model
- HTG-4CWL
- Grit
- 50#, 150#, 300#, 500#, 1000#
- Application
- Water Grinding
- Diameter
- 4 in / 102 mm
- Thickness
- 0.3 in / 8 mm
Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.
Need help selecting the right setup?
Send us your project requirements and we will recommend a fitting configuration and quote plan.