Industrial Product

Resin-Bond Diamond Segments HTG-4CWD

Description

The HTG-4CWD Resin Dry Polishing Pad is a premium 4-inch diamond tool engineered for aggressive cutting and high grinding efficiency. Featuring a heavy-duty hook-and-loop backing and a flexible base design, it ensures excellent floor adherence and reduces scratches. Compatible with XINGYI LE, HTG, and GX series grinders, this versatile pad is ideal for professional concrete floor polishing, as well as grinding and polishing marble, granite, and terrazzo surfaces in both wet and dry applications.

Product Overview

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Resin-Bond Diamond Segments HTG-4CWD

Configuration Options

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Model

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Product Overview

Resin-Bond Diamond Segments HTG-4CWD

The HTG-4CWD Resin Dry Polishing Pad is a premium 4-inch diamond tool engineered for aggressive cutting and high grinding efficiency. Featuring a heavy-duty hook-and-loop backing and a flexible base design, it ensures excellent floor adherence and reduces scratches. Compatible with XINGYI LE, HTG, and GX series grinders, this versatile pad is ideal for professional concrete floor polishing, as well as grinding and polishing marble, granite, and terrazzo surfaces in both wet and dry applications.

Product ID
HTG-4CWD
Selected
HTG-4CWD
Category
Resin-Bond Diamond Segments
Model
HTG-4CWD

Technical Parameters

Current selected specification

Model
HTG-4CWD
Grit
50#, 150#, 300#, 500#, 1000#
Application
For both dry and wet use
Diameter
4 in / 102 mm
Thickness
0.24 in / 6 mm

Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.

Need help selecting the right setup?

Send us your project requirements and we will recommend a fitting configuration and quote plan.