
Resin-Bond Diamond Segments HTG-4CWD
Resin-Bond Diamond Segments HTG-4CWD
Configuration Options
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Product Overview
Resin-Bond Diamond Segments HTG-4CWD
The HTG-4CWD Resin Dry Polishing Pad is a premium 4-inch diamond tool engineered for aggressive cutting and high grinding efficiency. Featuring a heavy-duty hook-and-loop backing and a flexible base design, it ensures excellent floor adherence and reduces scratches. Compatible with XINGYI LE, HTG, and GX series grinders, this versatile pad is ideal for professional concrete floor polishing, as well as grinding and polishing marble, granite, and terrazzo surfaces in both wet and dry applications.
- Product ID
- HTG-4CWD
- Selected
- HTG-4CWD
- Category
- Resin-Bond Diamond Segments
- Model
- HTG-4CWD
Technical Parameters
Current selected specification
- Model
- HTG-4CWD
- Grit
- 50#, 150#, 300#, 500#, 1000#
- Application
- For both dry and wet use
- Diameter
- 4 in / 102 mm
- Thickness
- 0.24 in / 6 mm
Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.
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