Industrial Product

Resin-Bond Diamond Segments HTG-4CWD

Description

Resin-Bond Diamond Segments HTG-4CWD

Product Overview

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Resin-Bond Diamond Segments HTG-4CWD

Configuration Options

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Model

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Product Overview

Resin-Bond Diamond Segments HTG-4CWD

Resin-Bond Diamond Segments HTG-4CWD

Product ID
HTG-4CWD
Selected
HTG-4CWD
Category
Resin-Bond Diamond Segments
Model
HTG-4CWD

Technical Parameters

Current selected specification

Model
HTG-4CWD
Grit
50#, 150#, 300#, 500#, 1000#
Application
For both dry and wet use
Diameter
4 in / 102 mm
Thickness
0.24 in / 6 mm

Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.

Need help selecting the right setup?

Send us your project requirements and we will recommend a fitting configuration and quote plan.