
Resin-Bond Diamond Segments HTG-3CDL
Resin-Bond Diamond Segments HTG-3CDL
Configuration Options
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Product Overview
Resin-Bond Diamond Segments HTG-3CDL
The HTG-3CDL Resin Dry Polishing Pad is a premium 3-inch diamond tool designed for concrete dry polishing. Featuring a heavy-duty hook-and-loop backing, it fits most standard floor grinders and stays secure at high speeds. It delivers uniform cutting and a fast, high-gloss finish on concrete, marble, granite, and terrazzo. Available in 50# to 400# grits for professional surface preparation.
- Product ID
- HTG-3CDL
- Selected
- HTG-3CDL
- Category
- Resin-Bond Diamond Segments
- Model
- HTG-3CDL
Technical Parameters
Current selected specification
- Model
- HTG-3CDL
- Grit
- 50#, 100#, 200#, 400#
- Application
- Concrete Dry Polishing
- Diameter
- 3 in / 76 mm
- Thickness
- 0.47 in / 12 mm
Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.
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