1 / 3
Resin-Bond Diamond Segments HTG-4CW2
Need help selecting the right setup?
1 / 3
Resin-Bond Diamond Segments HTG-4CW2
Configuration Options
Only keep the variants that really affect quote and selection.
* Required options
Product Overview
Resin-Bond Diamond Segments HTG-4CW2
FLM HTG-4CW2 diamond polishing pad features a premium abrasive formulation engineered for aggressive cutting and high grinding efficiency. It delivers a fast, mirror-like gloss on stone surfaces while minimizing equipment strain. The advanced heat-resistant resin prevents thermal burn marks, ensuring smooth, scratch-free grinding with exceptional wear resistance. *Floormart, floor more.*
- Product ID
- HTG-4CW2
- Selected
- HTG-4CW2
- Category
- Resin-Bond Diamond Segments
- MODEL
- HTG-4CW2
Technical Parameters
Current selected specification
- MODEL
- HTG-4CW2
- Grit
- 50#100#200#400#800# 1500 # 2000# 3000#
- Pad Size
- 10 cm x6 mm
Note: Product specifications may change with continuous upgrades. Please refer to the final sales proposal.
Need help selecting the right setup?
Send us your project requirements and we will recommend a fitting configuration and quote plan.